CMP Slurries
In the 1980s, CMC Materials was established as a pioneer in chemical mechanical planarization (CMP) slurries with the introduction of the Semi-Sperse™ line of slurry products for 250nm CMP applications. These revolutionary products established our reputation as a technology leader in the semiconductor industry. Today, we are the only supplier serving a broad range of customers by offering and supporting a full line of CMP slurry solutions for all major applications.
In addition to our longstanding Semi-Sperse™ offerings, CMC Materials remains focused on technology leadership by introducing new slurry solutions which meet our customers’ evolving CMP needs while reducing cost of ownership.
Tungsten CMP Polishing Slurries
CMC Materials’ tungsten slurries have been a standard in the semiconductor industry for decades. Our products are manufactured and consumed across the world to meet the performance requirements for all technology nodes and applications.
Semi-Sperse™
The combination of high purity fumed silica, unique rate accelerating agents, and industry leading product quality standards have made our Semi-SperseTM line of tungsten CMP slurries the most used and trusted name in tungsten CMP. These products offer selective tungsten removal with world-class product quality, performance and consistency.
Featured Product: Semi-Sperse™ W2000V
Semi-Sperse™ W2000V is the industry benchmark for tungsten CMP. This production-proven, selective tungsten slurry is based on high purity fumed silica and utilizes hydrogen peroxide as a removal rate enhancing additive. As the industry standard for tungsten slurry performance, Semi-Sperse™ W2000V delivers outstanding process reliability, consistency and supply assurance.
Features & Benefits
Improvement in Product Yield: Specially formulated high-purity slurry to achieve lower defectivity and excellent cleanability resulting in better product yield.
Lower Cost-of-Ownership: Formulated as a 2x concentrated slurry to reduce shipping and handling cost and to achieve lower point-of-use cost.
Ease of Use: Colloidally stable formulation that is easy to mix, filter and handle.
Dielectric/Advanced Dielectric CMP Polishing Slurries
CMC Materials introduced the first high purity fumed silica slurries for CMP of inter-layer dielectric (ILD) materials in the early 1980’s. Today, we continue to manufacture and deliver these products with the unsurpassed quality and consistency that our customers expect.
Additionally, CMC Materials has developed a portfolio of innovative new products for polishing dielectric layers in the advanced integrations that are used in the most leading-edge technology applications. With new discoveries such as patented selectivity agents, engineered abrasive particles, and tunable removal rates and selectivity, our next-generation products offer significant benefits to end users, including improved planarity, reduced defectivity, and lower cost-of-ownership.
Barrier CMP Polishing Slurries
As the focus of Barrier CMP shifts away from early process development to yield enhancement and cost of ownership reduction, polishing slurries assume a critical role, influencing both performance and total system cost.
Aluminum CMP Polishing Slurries
Our Novus™ product family contains uniquely engineered abrasive particles and chemistry to remove aluminum and the complex stack of work-function metals within the transistor gates of advanced semiconductor HKMG (High-K Metal Gate) devices.
Silicon Carbide Wafer Polishing Slurries
CMC Materials has developed a suite of silicon carbide wafer slurries that enable enhanced wafer throughput combined with excellent surface quality. Our two-component CMP slurries deliver removal rates that enable rapid healing of sub-surface damage and potential elimination of costly and surface damaging lapping steps.
Emerging CMP Applications
To meet the ever-increasing demands for higher computing performance, semiconductor device manufacturers have traditionally scaled down IC devices using existing materials. Many of these IC device designs and materials are approaching their physical limitations for further advancements.
To enable next-generation computing performance, there is a need to innovate new device structures, to build new integration schemes and to introduce new materials. CMC Materials is committed to technology and innovation leadership and is actively partnering with leading-edge IC device manufacturers to develop solutions which enable tomorrow’s technology. Our dedicated team of emerging CMP applications professionals support leading-edge customers with the journey from proof of concept through high-volume manufacturing.
