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Cabot Microelectronics Unveils iCue™ Copper CMP Technology

CMP Process Solutions Accelerating the Adoption of Copper in the Semiconductor Industry

AURORA, Illinois -- March 7, 2001 - Cabot Microelectronics Corp. (Nasdaq: CCMP), the leading supplier of chemical mechanical planarization (CMP) polishing slurries to the semiconductor industry, today unveiled the iCue™ line of copper polishing slurries used in the manufacture of the most advanced integrated circuits (ICs).

The need for smaller, faster and higher performance chips is driving the semiconductor industry to adopt new materials of construction like copper wiring. Cabot Microelectronics' iCue™ technology leads the way with proven process performance by supplying various polishing slurries required in the copper interconnect process.

"iCue™ slurries are designed to address the current and evolving needs of our customers and provide them with the expertise and global support required to implement the copper CMP process," stated Kathleen Perry, Vice President of Research and Development at Cabot Microelectronics. "Copper CMP polishing is considered by many as one of the more challenging polishing steps, however through extensive and ongoing research, product development and collaborations with tool suppliers and chipmakers around the world, we are able to deliver high-performance slurries that reduce these challenges. Additionally, we offer our customers the assurance of unmatched global supply and support. In fact, multiple global customers have already adopted iCue™ slurries in their commercial IC fabrication processes."

Cabot Microelectronics' scientists have formulated application specific slurries for polishing both the bulk copper and barrier layer films deposited during the copper interconnect fabrication process. They have developed multiple products to enable different integration schemes depending on specific customer needs. To further simplify integration, all copper and barrier iCue™ slurries are compatible with each other, allowing same platen polishing.

"Backed by a world-class R&D team, Cabot Microelectronics is fully committed to developing and supplying a superior line of CMP technologies to meet the growing need for smaller, faster and more powerful chips," added Perry.

About Cabot Microelectronics Corporation

Cabot Microelectronics, headquartered in Aurora, Illinois, USA, is the world leader in the development and supply of high-performance polishing slurries used for chemical mechanical planarization (CMP), a process that enables the manufacture of the most advanced integrated circuit (IC) devices and hard disk drive components. Cabot Microelectronics' global network of facilities encompasses corporate headquarters, a state-of-the-art research and technology center, and manufacturing plants in Aurora; manufacturing plants in the United Kingdom, Japan and the United States; and regional sales, technical applications and support offices strategically located throughout the world. The Company reported fiscal 2000 revenues of $180 million.

Safe Harbor Statement

The statements contained in this news release may contain "forward-looking statements." Actual results may differ materially from those anticipated in such forward-looking statements. All of these statements are expressly qualified in their entirety by the risk factors and other cautionary statements included in Cabot Microelectronics' filings with the Securities and Exchange Commission.

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